Process for treating metal surface.

摘要

A process for treating a surface of a metal such as copper with a liquid composition comprising (I) copper ions, a complexing agent, a reducing agent, a pH adjusting agent, water, and (II) a nitrogen-containing organic compound such as heterocyclic compound or containing -N= and -NH<Sub>2</Sub> and/or -OH groups in its molecule can give multilayer printed wiring boards having excellent adhesive strength and line definition of inner layer copper conductors with long shelf life.