发明名称 High rate, low temperature silicon deposition system
摘要 A radio frequency, plasma-enhanced, vapor deposition reactor has apparatus (3-7) for providing a flow of silane in an inert gas carrier, a deposition chamber (20) formed between a pair of flow restrictors (18, 27) and an RF coil (22) for providing inductive coupling of RF power (24) for plasma excitation, disposed downstream of a fixture (8) for holding the substrate upon which amorphous silicon is to be disposed. A baffle (30) provides diversion of the gas flow toward a gravity trap chamber (31), thereby collecting some particulates and prolonging the cycle time before plugging of the vacuum pump (7) can occur.
申请公布号 US4583492(A) 申请公布日期 1986.04.22
申请号 US19830562625 申请日期 1983.12.19
申请人 UNITED TECHNOLOGIES CORPORATION 发明人 COWHER, MELVYN E.;SHUSKUS, ALEXANDER J.
分类号 C23C16/507;H01J37/32;(IPC1-7):C23C16/50 主分类号 C23C16/507
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