| 摘要 |
PURPOSE:To prevent a shortcircuit due to the proximity and a withstand voltage from decreasing by applying a back tension from above a capillary to fine metal wirings to shape the wirings. CONSTITUTION:A capillary 2 for holding and guiding fine metal wirings 1 is moved above the first bonding portion 5 in a semiconductor pellet 4, one end of the wirings 1 is supersonic-bonded to the first bonding portion 5, and the capillary 2 is then moved to the second bonding portion 7 in spacing leads 6 while leading the wirings 1. The capillary 2 is steadily disposed above the bonding portion 7, the wirings 1 are clamped by a back tension applying unit 8 to lift it above. The back tension is applied to the wirings 1 to correct and shape its curl or slack as irregular shape. Thus, it can prevent the wirings from abnormally approaching other article such as a heat sink plate to shortcircuit therebetween or the withstand voltage from decreasing. |
