| 摘要 |
PURPOSE:To readily automate manufacturing steps by disposing solders of different melting points between a metal electrode and semiconductor substrate, individually heating them, and executing scribing step. CONSTITUTION:Laminated parts of a high melting point solder tablet 2 and a rectifier 3 are maintained at approx. 360 deg.C in a wide portion 5 of a metal electrode 1, and engaged with a heater 6 disposed in atmosphere of H2:N2=1:9. When the high melting point solder is melted, scribing step is executed to remove air bubbles contained in the solder layer, and the smoothness of the wide portion 5 is compensated. After the solder layer is cooled, other metal electrode 1 by low malting point solder and the rectifier 3 are secured. Then, laminated reversely to the case of high melting point solder, heated and scribing step is similarly executed. |
