| 摘要 |
<p>Soldering apparatus and method wherein an assembly (10) containing solder (16) is simultaneously subjected to vapor heating and ultrasonic vibration to provide for fluxless soldering. The solder (16) is heated in a solder pot (14) which creates a hot vapor space (38) above the surface of the solder (16). A transducer (22) vibrates the solder (16) in the pot (14) while the circuit board to be soldered floats on the surface of the solder (16). This invention is particularly useful for circuit board assemblies which are sensitive to cleansing in preparation for soldering and solder fluxes.</p> |
