| 摘要 |
PURPOSE:To obtain a resin sealed type light-emitting device, which can scatter beams to the whole resin, by sealing a light-emitting element by a photo polymerization composition in which the component composition of an epoxy resin, an aluminum compound, an silicon compound having peroxysilyl groups, and polymethyl sesquioxan having specific mean grain size is limited. CONSTITUTION:A light-emitting element is sealed by using a photo polymerization composition consisting of a 100pts.wt. epoxy resin, a 0.001-10pts.wt. aluminum compound, a 0.1-20pts.wt. silicon compound having peroxysilyl groups and a 0.1-50pts.wt. polymethyl having 0.1-100mum mean grain size. The epoxy resin is composed of only an epoxy compound or a mixture of the epoxy compound and one kind or two kinds or more of compounds selected from a group consisting of an acid anhydride, a phenol group compound and a compound having ethylene unsaturated groups. One kind or two kinds or more of mixed system compounds may be employed as the aluminum compound, and the quantity of them added and compounded is kept within a range of, preferably, 0.1-5 pts.wt. to the 100pts.wt. epoxy resin. |
