| 摘要 |
A compliant pin for preferable insertion into a multi-layer backpanel is disclosed. The pin includes a wire-wrap area, a pin stop, and a connector area. Between the connector area and the stop there is located the compliant area which forms the critical function of pin support and electrical connection. The compliant area includes first and second legs spreading out to define an eye from the pin stop adjacent the wire-wrap area of the pin. Similarly, the paired legs come together at a symmetrically defined eye adjacent the connector area. In between the eyes, along the compliant portions of the leg, are formed opposing offset wedges. The opposing offset wedges are defined by a stamping process which process does not deform the sheet of material out of which the pin is made from its original planar disposition. Looking at the pin in section, paired and offset wedges are formed at an approximate 45 DEG angle to the plane of the material from which the pin is formed. These wedges are offset so that when the legs are urged towards one another the apexes of the wedges move to contact the surface of the opposing wedge. Upon such contact, a sliding interface occurs. Exteriorly of the wedge area the pin at each wedge is provided with a broad area of contact at the hole, preferably spaced apart shoulders. These shoulders bear upon the surface of the cylindrical apertures into which the pin is placed. In insertion, the compliant legs come in contact with the cylindrical holes. They are urged one towards the other until contact is made. Thereafter, the compliant legs are urged against another and form a sliding interface which interface for the first time functions to deform the pin members out of the plane of the material from which they were formed. A pin with adequate electrical connection to a large range of hole diameters with structural rigidity results.
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