发明名称 Heat transfer wall
摘要 In a perforated heat conductive surface structure having voids under an outer surface and openings in the outer surface, in order to obtain a high performance in particular at a low pressure and low temperature region, there is provided a heat transfer wall in which a thickness of a wall at a ceiling of each void and a length of a passage of the respective openings are increased in predetermined ranges.
申请公布号 US4606405(A) 申请公布日期 1986.08.19
申请号 US19850701161 申请日期 1985.02.13
申请人 HITACHI, LTD.;HITACHI CABLE, LTD. 发明人 NAKAYAMA, WATARU;NAKAJIMA, TADAKATSU;KUWAHARA, HEIKICHI;YASUKAWA, AKIRA;DAIKOKU, TAKAHIRO;YOSHIDA, HIROMICHI
分类号 F28F13/02;F28F1/10;F28F13/00;F28F13/18;(IPC1-7):F28F13/02 主分类号 F28F13/02
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