| 摘要 |
<p>PURPOSE:To satisfy both laser marking property and adhesion to a substrate simultaneously in a flat-mounting-type resin-sealed semiconductor device, by forming a mirror surface as a marking surface and forming a satin finished surface as a surface, which is in contact with the substrate, for the surface finishing state of a resin molded layer. CONSTITUTION:Of four kinds of planes of a resin molded layer, a marking surface f1 is made to be a mirror surface, and a contact surface f2 to a substrate is made to be a satin finished surface. In order to facilitate the manufacture of a metal mold, an upper side surface f3 is made to be a mirror surface, which is the same as the marking surface f1. A lower side surface f4 is made to be a satin finished surface, which is the same as the contact surface f2. Since the marking surface f1 is the mirror surface, excellent contrast of a laser mark is obtained. Since the contact surface f3 to the substrate is the satin finished surface, excellent adhesion is obtained in mounting the layer on a printed wiring board 3 through a bonding agent layer 4.</p> |
