| 摘要 |
<p>PURPOSE:The titled adhesive, obtained by dispersing cured heat-resistant resin powder soluble in an oxidizing agent in an uncured heat-resistant resin solution which becomes slightly soluble in the oxidizing agent by curing, having improved heat resistance and electrical characteristics and useful for wiring boards. CONSTITUTION:An adhesive obtained by dispersing precured fine heat-resistant resin powder, soluble in an oxidizing agent, and having <=10mum average particle diameter, preferably an epoxy resin, polyester resin and/or bismaleimide-triazine resin in an uncured heat-resistant resin solution having characteristics of becoming slightly soluble in the oxidizing agent by curing treatment, preferably epoxy resin, epoxy-modified polyimide resin, polyimide resin and/or phenolic resin. The resultant adhesive is applied to a substrate, dried and cured to form an adhesive layer. At least part of the above-mentioned fine particles dispersed in the surface part of the above-mentioned adhesive layer are dissolved and removed to roughen the surface of the adhesive layer. Electroless plating is then carried out to afford a wiring board. EFFECT:Improved adhesion of the substrate to the electroless plating film.</p> |
