发明名称 BONDING OF THIN FILM
摘要 PURPOSE:To raise the hardness and smoothness of the surface as well as provide gas barrier property and moisture proofness for the surface by a method in which a thermoplastic resin thin film is put on the surface of an object to be bonded, pressed, heated to a bonding temperature under the pressed condition, and then cooled. CONSTITUTION:A thin film of plastics is closed contacted with an object to be bonded, e.g., metal, ceramics, plastics, etc., and heated to a bonding temperature under pressure. After the object with the thin film is kept under pressed and heating conditions for a fixed period of hour, they are cooled at the same speed as in feeding under the condition that it is kept under much the same pressure as in the holding. The thin film can thus be uniformly bonded to the object without staying air bubbles in the bonded face, permitting the hardness and smoothness of the surface of the object to be improved. Gas barrier property and water proofness can also be provided for the surface.
申请公布号 JPS61295025(A) 申请公布日期 1986.12.25
申请号 JP19850138755 申请日期 1985.06.25
申请人 MITSUBISHI PETROCHEM CO LTD 发明人 HOSONO TAIJI;OKUYAMA KATSUMI;ITO MINORU;MIZUTANI HIROYASU
分类号 B29C63/02;B29C65/00;B29C65/02;B29L9/00 主分类号 B29C63/02
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