SYSTEM AND METHOD FOR INSPECTING WAFERS

摘要

PROBLEM TO BE SOLVED: To provide an inspection system for inspecting semiconductor wafers.SOLUTION: An inspection system includes an illumination setup for providing broadband illumination. The broadband illumination can be of different contrasts, for example, bright-field and dark-field broadband illumination. The inspection system further includes a first image capture device and a second image capture device, each configured to receive broadband illumination so as to capture images of a semiconductor wafer while the semiconductor wafer is in motion. The system has a number of tube lenses for enabling collimation of the broadband illumination. The system also has a stabilizing mechanism and an objective lens assembly. The system further has a thin line illumination emitter and a third image capture device for receiving thin line illumination to thereby capture three-dimensional images of the semiconductor wafer. The system includes a reflector assembly for enabling the third image capture device to receive illumination reflected from the semiconductor wafer in multiple directions.SELECTED DRAWING: Figure 1