| 摘要 |
PURPOSE:To prevent the generation of flaws and stains on a high-polymer film by sticking a surface protective film on the opposite face of the high- polymer film having a conductive film on one face, tentatively fixing the same to a plate and etching the conductive film. CONSTITUTION:The thin conductive film consisting of a metal such as Ag, Cu or Al or metallic oxide such as SnO or In2O3 is deposited by a vacuum deposition method on one face of the high-polymer film consisting of a polystyrene, polymethyl acrylate, PVC, etc., as a substrate. A photosensitive film resist mask of a water soluble treatment type is formed on such thin film and the protective film consisting of a PE film and acrylic self-adhesive agent is formed on the opposite surface of the high-polymer film. The photosensitive film resist mask is exposed with a desired pattern and thereafter, the protective film surface is fixed to the surface of the plate material. The resist mask in the unexposed part is dissolved and the film is etched. The resist film on the remaining surface is stripped and the film of the conductive pattern having no flaws and stains is thus formed on the high-polymer film. |
