| 摘要 |
PURPOSE:To make the external measurements small as well as to enhance the degree of integration of the titled device by a method wherein the IC chip die-bonded frame and another frame, on which the externally attached part of the IC chip is mounted, are adhered back to back, and they are resin-molded. CONSTITUTION:An IC chip 2 is die-bonded to a frame 3a, and they are assembled in the same flow of assembling of the ordinary integrated circuit device until a wire bonding is completed. On the other hand, the soldering work such as solder reflowing and the like is performed as the method for mounting of an externally attaching part 6 on a frame 3b. Said two kinds of frames 3a and 3b are superposed back to back based on the positioning pin on a molding metal mold in a molding process, they are sealed using the same molding resin, and the IC chip 2, the frames 3a and 3b and the externally attaching part 6 are fixed. After the resin molding work has been finished, the pins 6a, 6b and 6c are electrically connected using the method of plating, solder dipping and the like. |
