发明名称 |
DEVICE ATTACHMENT WITH DUAL BAND IMAGING SENSOR |
摘要 |
Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. The device attachment may include an infrared imagining module and a non-thermal imaging module that cooperate with one or more of a non-thermal imaging module in an attached device and a light source in the attached device for capturing and processing images. |
申请公布号 |
US2016316154(A1) |
申请公布日期 |
2016.10.27 |
申请号 |
US201615199867 |
申请日期 |
2016.06.30 |
申请人 |
FLIR Systems, Inc. |
发明人 |
Elmfors Per;Kent Michael |
分类号 |
H04N5/33;G01J5/04;H04M1/02;H04N13/00;H04N13/02;H04N5/225;G01J5/02;G01J5/08 |
主分类号 |
H04N5/33 |
代理机构 |
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代理人 |
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主权项 |
1. A system comprising:
a device attachment having a thermal imaging module and a non-thermal imaging module; and a processor configured to determine a parallax correction for the thermal imaging module and the non-thermal imaging module based on a first non-thermal image from the non-thermal imaging module and a second non-thermal image from a camera of a device attached to the device attachment. |
地址 |
Wilsonville OR US |