发明名称 DEVICE ATTACHMENT WITH DUAL BAND IMAGING SENSOR
摘要 Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. The device attachment may include an infrared imagining module and a non-thermal imaging module that cooperate with one or more of a non-thermal imaging module in an attached device and a light source in the attached device for capturing and processing images.
申请公布号 US2016316154(A1) 申请公布日期 2016.10.27
申请号 US201615199867 申请日期 2016.06.30
申请人 FLIR Systems, Inc. 发明人 Elmfors Per;Kent Michael
分类号 H04N5/33;G01J5/04;H04M1/02;H04N13/00;H04N13/02;H04N5/225;G01J5/02;G01J5/08 主分类号 H04N5/33
代理机构 代理人
主权项 1. A system comprising: a device attachment having a thermal imaging module and a non-thermal imaging module; and a processor configured to determine a parallax correction for the thermal imaging module and the non-thermal imaging module based on a first non-thermal image from the non-thermal imaging module and a second non-thermal image from a camera of a device attached to the device attachment.
地址 Wilsonville OR US
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