| 摘要 |
A process for manufacturing multilayer printed circuit boards having conductive patterns located in three planes by assembling a stack of laminate layers with at least one prepreg between adjacent laminate layers, the laminate layers having holes around a periphery thereof for aligning the laminate layers with respect to each other. Then, the stack of laminate layers and prepregs are secured together with fastening elements, such as rivets, which deform the outermost laminate layers towards each other such that the outermost ends of the fastening elements are spaced a distance apart less than the maximum thickness of the stack. Finally, the stack of fastened laminate layers and prepregs is subjected to heat and pressure during a curing step which may follow or precede the securing step.
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