| 摘要 |
<p>A flexible chip interconnection means includes a flexible film (10) having interconnection lines (11, 12) formed on opposite sides thereof, with selected of the interconnection lines from one side connected by through-film conductors (15) to interconnection lines on the other side. Insulating layers (16, 17) cover both sets of lines on the other side. Insulating layers cover both sets of interconnection lines. Multi-chip circuits can be formed on the film with the interconnection lines directly connecting the chips.</p> |
