发明名称 STRUCTURE OF PIN GRID ARRAY PACKAGE
摘要 PURPOSE:To prevent the moisture infiltration through the end of pin grid array made of plastic (plastic PGA) by a method wherein both ends of substrate on the peripheral part of plastic PGA and the edge of peripheral part are coated with metal. CONSTITUTION:The peripheral end and edge of a pin grid array made of plastic (plastic PGA) are plated with a metal in thickness exceeding 10 mum and coated with an inorganic base sealer 7 to interrupt infiltration of moisture into a printed circuit board (PCB) and the interface between the sealer 7 and PCB. PGA covers the peripheral end and edge to be the inlets of moisture with a metallic film 6, further enabling interruption of the moisture infiltration through the end of PCB and the interface between the sealer and PCB by coating them with inorganic sealer. Through these procedures, the deterioration in insulation resistance between throughholes and the corrosion of IC with moisture can br prevented from occuring.
申请公布号 JPS62274753(A) 申请公布日期 1987.11.28
申请号 JP19860118468 申请日期 1986.05.23
申请人 SEIKO INSTR & ELECTRONICS LTD 发明人 KIMURA TAKAYUKI;ADACHI HIDEAKI
分类号 H01L23/02;H01L23/10 主分类号 H01L23/02
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