发明名称 Submicron bipolar transistor with buried silicide region.
摘要 <p>A high performance bipolar transistor structure is disclosed which exhibits an extremely low extrinsic base resistance (r b) by virtue of a silicide layer (26) which is included in the base contact portion of the structure. The silicide layer is situated to be electrically in parallel with the conventional heavily-doped polysilicon base contact region (24), where a vertical polysilicon runner (36') is used to provide a self-aligned electrical contact to the base. The parallel combination of the low resistivity (0.5-4 ohm/square) silicide with the polysilicon (sheet resistance of 10- 100 ohm/square) results in a low extrinsic base resistance on the order of 0.5-4 ohm/square. The disclosed device also includes a sub-micron emitter size, defined by vertical oxide sidewalls (40') above the base region (42), which furth er improves the high frequency performance of the device.</p>
申请公布号 EP0248606(A2) 申请公布日期 1987.12.09
申请号 EP19870304774 申请日期 1987.05.29
申请人 AT&T CORP. 发明人 FEYGENSON, ANATOLY
分类号 H01L29/73;H01L21/331;H01L29/423;H01L29/732;(IPC1-7):H01L29/72;H01L29/62 主分类号 H01L29/73
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