发明名称 EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR
摘要 PURPOSE:To obtain the titled composition having excellent adhesiveness between rubber component and epoxy resin matrix, improved heat cycle resistance and heat resistance, containing a modified fluororubber obtained by modifying fluororubber with a specific surface active agent. CONSTITUTION:(A) Modified fluororubber obtained by modifying (i) fluororubber with (ii) a copolymerized surface active agent of a perfluoroalkyl group- containing acrylate compound (e.g. compound shown by formula I, etc.) and (meth)acrylate (e.g. compound shown by formula II, etc.) is blended with (B) a polyfunctional epoxy resin compound, (C) a phenolic novolak resin, (D) an inorganic filler and (E) a curing promoter to give the aimed composition. The blending ratio of the component i and ii of the component ii/i is preferably 0.002-0.03 and a terpolymer of tetra-fluoroethylene, vinylidene fluoride and hexafluoropropylene, etc., is preferably used as the component i.
申请公布号 JPS63132923(A) 申请公布日期 1988.06.04
申请号 JP19860279074 申请日期 1986.11.21
申请人 MITSUBISHI ELECTRIC CORP 发明人 FUJIMOTO TAKAMITSU;KANEGAE YUZO;KITA SHUICHI;SHINODA ATSUKO;MORIWAKI NORIMOTO
分类号 H01L23/29;C08G59/00;C08G59/18;C08G59/62;C08L63/00;H01L23/31 主分类号 H01L23/29
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