| 摘要 |
PURPOSE:To contrive the realization of a cost-down and a large sized sensor and the ease of its manufacture by connecting one or above of photodiode array chips with a scanning circuit formed on the same chip thereupon in cascade to mount them. CONSTITUTION:Video output terminals VIDEO1, VIDEO2 of image sensor chips 102, 103 are connected via a mounting substrate 101 and an end pulse terminal, the inverse of EP of the image sensor chip 102 and a start pulse terminal, the inverse of SP of the image sensor chip 103 are connected via the substrate 101. Terminals VIDEO1, VIDEO2, VBB, VDD, CL, the inverse of CL, and the inverse of SP are connected as input/output terminals 105 for the substrate 101, and the image sensor chips 102, 103 are mounted so that the highly accurate connecting faces 106 are opposed to each other, thereby arranging the photo diodes in both the sensor arrays of the image sensor chips 102, 103 are arranged in a line at an equal interval. Thus, the cost of the contact type image sensor is reduced by a simple constitution.
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