| 摘要 |
A substrate with a heat producing electronic component is mounted directly on a heat dissipating structure. The heat dissipating structure has a closed chamber with adjacent condenser and evaporator sections and contains a supply of liquid cooling fluid with a predetermined vaporization temperature. The evaporator section is in heat transfer relation with the substrate and the electronic component thereon. A plurality of channels are strategically arranged in the surfaces bounding the chamber to move the cooling fluid by capillary action in a predetermined path between the condenser and evaporator sections in heat exchange relationship over the chamber walls to maintain the substrate at an acceptable temperature. A heat sink, in heat exchange relationship with the condenser section of the heat dissipating structure, maintains a temperature differential between the evaporator and condenser sections and assures that the condenser section is cooled sufficiently to condense the cooling fluid. |
