发明名称 Plasma enhanced chemical vapor deposited vertical silicon nitride resistor
摘要 An improved resistor for use in MOS integrated circuits. An opening is formed in an insulative layer which separates two conductive regions. A plasma enhanced chemical vapor deposition of passivation material such as silicon-rich silicon nitride is deposited in the window, contacting both conductive regions and providing resistance in a vertical direction between these regions.
申请公布号 US4786612(A) 申请公布日期 1988.11.22
申请号 US19870139187 申请日期 1987.12.29
申请人 INTEL CORPORATION 发明人 YAU, LEOPOLDO D.;CHEN, SHIH-OU;LIN, YIH S.
分类号 H01L21/02;H01L27/11;(IPC1-7):H01C7/10;H01L29/04 主分类号 H01L21/02
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