| 摘要 |
<p>Integrated circuit chips (11) are attached, and electrically connected across a desired distance, to a substrate (31) in a facing relationship; electrical interconnection typically involves solder connections (52) between facing contact pads. Positive control of the desired distance is achieved by chip and/or substrate surface spacer features such as, e.g., miniature pyramids (33) - optionally in combination with matching opposite features. Conveniently, in the case of silicon chips on a silicon substrate, as well as in the case of analogous Group III-V compound semiconductor structures, surface spacer features are produced by orientation dependent chemical etching.</p> |
