| 摘要 |
The invention relates to electronic semiconductor devices which need to be equipped with cooling means such as, for example, power transistors or integrated circuits which comprise the same. In an electronic device according to the invention which comprises a wafer of semiconductor material (1), one face of which exhibits at least one active zone (7) and carries metallisations (4, 5, 6) and contact pins (10) to form an integrated electronic component (3) and a layer of protective insulating material (8) which covers this face of the wafer, these cooling means comprise a metallic area (14) formed on this protective layer, which covers at least a part of the active zone of this component, a heat dissipating element (16) and a metallic link (15) between this element and the area. <IMAGE> |
