| 摘要 |
PURPOSE:To effectively connect a semiconductor element to a metallized metal layer by providing an alloy layer containing as a main ingredient gold on the metal layer at a position connected to the electrode of the element. CONSTITUTION:An insulating base 1 made of ceramics or the like has a recess for containing a semiconductor element 6 at the center of its upper face, and a metallized metal layer 3 made of metal powder of W, Mo, etc., for connecting to an external electric circuit is formed from the recess stepwise upper face to a side face and a bottom. Since a metal layer 4 made of Pt, Pd or their alloy is formed by plating on the bottom of the layer 3 at the side of the base 1, it can be rigidly braked to a conductor 9 on a circuit substrate 8 with solder 10. Since a metal layer 5 which contains as a main ingredient Au is formed by plating on the recess stepwise upper face of the layer 3, it can be effectively and rigidly adhered to a wiring 7. Since the layers 4, 5 are chemically stable, they are not rusted. A cover 2 made of kovar or the like is mounted with a sealing member 11 made of Au-Sn alloy or the like. |
