摘要 |
<p>In a method of producing an electronic circuit part (31), which contains a circuit material distributed therein, on a surface of a supporting body (48), an apparatus (10) is employed in which a stream (28) of a primary liquid is ejected under pressure from a nozzle (20) and directed through a thin layer of a secondary liquid (17) so as to form a compound liquid stream breaking up into a jet of compound liquid droplets (25). The stream of compound liquid droplets is directed towards the surface of the supporting body so as to form a deposition of the compound liquid, which is a curable liquid, on the surface. The deposition of the curable liquid is allowed to cure so as to form the electronic circuit part (31) on the surface of the supporting body (48). The primary and secondary liquids preferably constitute a primary/secondary liquid system which is a non-heat curable/two-component ink or glue system such as an epoxy or polymer based glue or ink. The stream (28) of the primary liquid and the jet of compound liquid droplets are deflectable by means of deflection plates (24, 26; 44, 46; 54, 56).</p> |