| 摘要 |
<p>A socket (10, 40, 70, 100) for a leadless ceramic chip carrier (34, 66, 96) comprised of a ceramic material which is preferably substantially identical to the ceramic material composing the leadless chip carrier (34, 66, 96) (typically alumina). The use of the ceramic socket (10, 40, 70, 100) of the present invention provides an essentially exact match between the coefficients of thermal expansion of the chip carrier (34, 66, 96) and the socket and thereby eliminates the problems of the prior art regarding catastrophic failure of the solder joints. Another important feature of the novel leadless chip carrier socket (10, 40, 70, 100) of the present invention (in addition to its ceramic composition) is the incorporation of the decoupling function in the ceramic socket itself. As a result, undesirable lead inductance (present in prior art plastic molded sockets) is reduced as well as more efficient (relative to conventional decoupling schemes) utilization of printed wiring board (36, 68, 98, 106) ''real estate''.</p> |
