发明名称 |
Method of sealing electric and electronic parts |
摘要 |
A method of sealing electric and electonic parts, comprising employing two different ultraviolet-curing resins for upper and lower layer portions, respectively, the resin employed for the upper layer portion having a smaller specific gravity than that of the resin for the lower layer portion before the resins are cured, and simultaneously curing the resins by irradiation with an ultraviolet ray. The ultraviolet-curing resin employed for the upper layer portion is an epoxy acrylate or epoxy resin, while an urethane acrylate ultraviolet-curing resin is employed for the lower layer portion, and the thickness of the ultraviolet-curing resin employed for the upper layer portion is set at from 0.5 mm to 3 mm.
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申请公布号 |
US4849048(A) |
申请公布日期 |
1989.07.18 |
申请号 |
US19870060167 |
申请日期 |
1987.06.10 |
申请人 |
AISIN SEIKI KABUSHIKI KAISHA |
发明人 |
INAGAKI, AKIO;NAKAI, KIYOTAKA;TAUCHI, HITOSHI |
分类号 |
H01B17/60;B29C35/08;B29C39/10;B29C39/12;B29C70/74;B29K63/00;B29K75/00;B29L31/34;H01C1/024;H01G13/00;H01H9/04;H01H11/00;H01H36/00;H01L23/02;H05K3/28;H05K5/06 |
主分类号 |
H01B17/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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