Semiconductor arrangement and method for its production

摘要

Semiconductor layers (2, 3) which form a p-n junction (4) are constructed on the surface of an insulating substrate (1), a partial area being exposed. Located on the partial area (1b) of the insulating substrate (1) is a region for the connection of an electrode (5), which is connected to an external connection. The external connection is bonded on the region (1b) provided for the connection in order to prevent mechanical damage to the semiconductor layers (2, 3) which form the p-n junction, the photoelectric efficiency and the reliability of the arrangement at the same time being improved. Furthermore, a robust electrode arrangement can be achieved, since the electrode can be constructed directly on the insulating substrate (1) (Fig. 2).