发明名称 Process for making a high density split gate nonvolatile memory cell
摘要 A process is disclosed for producing a high density split gate nonvolatile memory cell which includes a floating gate and a control gate that is formed above the floating gate. The drain region is self-aligned to the floating gate and the source region is self-aligned to the control gate. Fully self-aligned implantation is made possible by the process and structure using self-aligned etch. Programming of the memory cell uses standard EPROM programming, and erasing is accomplished by Fowler-Nordheim tunneling or photoemission. The memory cell can be made with a reduced cell size and read current uniformity is obtained.
申请公布号 US4861730(A) 申请公布日期 1989.08.29
申请号 US19880147843 申请日期 1988.01.25
申请人 CATALYST SEMICONDUCTOR, INC. 发明人 HSIA, STEVE K.;MAHAL, PRITPAL S.;SHIH, WEI-REN
分类号 G11C16/04;H01L21/28;H01L21/336;H01L21/8246;H01L21/8247;H01L27/112;H01L27/115;H01L29/788;H01L29/792 主分类号 G11C16/04
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