发明名称 |
Molded circuit board and manufacturing method therefor |
摘要 |
A molded circuit board is formed with a nonconductive molded polymer substrate base having at least one channel in a surface thereof. A sputtered conductive film is disposed in the channel on a virgin polymer surface thereof to establish a circuit line in the channel.
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申请公布号 |
US4861640(A) |
申请公布日期 |
1989.08.29 |
申请号 |
US19880153565 |
申请日期 |
1988.02.03 |
申请人 |
JOHN FLUKE MFG. CO., INC. |
发明人 |
GUROL, ISMAIL M. |
分类号 |
H05K3/04;H05K3/10;H05K3/28;H05K3/34;H05K3/38;H05K3/42 |
主分类号 |
H05K3/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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