发明名称 Molded circuit board and manufacturing method therefor
摘要 A molded circuit board is formed with a nonconductive molded polymer substrate base having at least one channel in a surface thereof. A sputtered conductive film is disposed in the channel on a virgin polymer surface thereof to establish a circuit line in the channel.
申请公布号 US4861640(A) 申请公布日期 1989.08.29
申请号 US19880153565 申请日期 1988.02.03
申请人 JOHN FLUKE MFG. CO., INC. 发明人 GUROL, ISMAIL M.
分类号 H05K3/04;H05K3/10;H05K3/28;H05K3/34;H05K3/38;H05K3/42 主分类号 H05K3/04
代理机构 代理人
主权项
地址