SUBSTRATE HYBRID IC METHOD OF FORMING A CIRCUIT PATTERN AND APPARATUS OF FORMING THE SAME

摘要

An electric circuit pattern is formed on a substrate by (i) coating a soln.-retaining film on a substrate where the soln.retaining film allows a soln. that contains an electric circuit element-forming material and a solvent for permeation and retention at the position at which the soln. initially contacts the film; (ii) depositing the soln. on the film in accordance with a predetermined pattern; (iii) enabling the deposited soln. to permeate through the film; (iv) pre- heating the substrate to cause evapn. of the deposited solvent; and (v) baking the rest of the soln., the film and the substrate to cure the rest of the soln. and bake off the film leaving a printed electric circuit.