MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

Semiconductor device having a package structure with a lead base and a cap is made by: fixing a chip (1) to a lead base (2); placing a fixation pellet (50) of material which melts and then hardens when heated in a cap (6); placing the base and chip upside down on the pellet in the cap; and heating to melt and harden the pellet and fix the base-chip to the cap.