Thermosetting-resin-forming compositions.

摘要

This invention provides thermosetting-resin-forming compositions which are formed of (a) a bismaleimide compound represented by the following formula: <CHEM> wherein R represents a divalent group of <CHEM> or <CHEM> X being a direct bond or a group selected from divalent hydrocarbon groups having 1-10 carbon atoms, hexa-fluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxo, and (b) a specific diallylbisphenol compound. These compositions can provide thermosetting resins having high cracking resistance due to improved impact resistance and toughness and low water absorption.