AN EXTERNAL ISOLATION MODULE IN COMBINATION WITH A DEPOSITION APPARATUS IN WHICH SEMICONDUCTOR MATERIAL IS DEPOSITED ONTO A SUBSTRATE

摘要

The invention concerns an external issolation module (42) adapted to operatively interconnect at least one pair of a plurality of adjacent vacuum chambers (28, 30) through which a substrate (11) travels and into which reaction materials are introduced. The external isolation module (42) provides a passageway (44) for the substrate (11) between adjacent chambers while substantially preventing the diffusion of reaction materials from one of the chambers into the adjacent chamber. An accessible, environmentally-sealed, reaction material-isolating passageway is thereby formed.