MANUFACTURE OF CERAMIC CIRCUIT SUBSTRATE

摘要

The ceramic circuit board is prepared by the stages of forming a conductor portion of the ceramic circuit board by printing a conductive paste compsn. on a ceramic base plate (pref. a ceramic green sheet) and then firing the ceramic base plate together with conductive paste compsn., where a copper-base compsn. comprising 100 wt.% copper powder and 0.5-5 wt.% (pref. 0.5-3.5 wt.%) of at least one organometallic cpd. (pref. an organic titanate or aluminate cpd) capable of forming an organic cpd. or cpds. when fired in an inert atmos. is used as the conductive paste compsn.