| 摘要 |
<p>In a semiconductor device, an outer lead (5 min , 8a-8h) is divided into plural leads at an outer lead region connected to an inner lead (5, 7) which is connected to an electrode terminal (6, 10, 31) of a semiconductor chip (2), a plurality of TAB packages (A-D) on which the semiconductor chip has been packaged are stacked in plural layers, at least one of the plural divided leads every stacked layers is left and a predetermined number of the divided leads are cut out, and these stacked TAB packages are mounted on a circuit board. <IMAGE></p> |
