Heat sink system for circuit boards - has profiled heat sink plate position on top of circuit board components

摘要

Electronic printed circuit boards (1) support a number of different circuit components that can be in the form of integrated circuit chips (2) or discrete elements (3,4). Mounted on top the elements are a number of heat sink units (6) that dissipate the generated thermal energy. Each heat sink is in the form of a plate, e.g. of aluminium, that can be machined or cast and has cooling fins on the top surface. The underside has a profile to suit the different heights and shape of the components. A layer of heat conducting plastic (7) is in contact with the elements. ADVANTAGE - Improves dissipation of thermal energy.