发明名称 PRINTED CIRCUIT BOARD, MANUFACTURING METHOD THEREOF AND ELECTRONIC COMPONENT MODULE
摘要 PROBLEM TO BE SOLVED: To provide a printed circuit board, a method of manufacturing the same and an electronic component module that are applicable to increasingly more functional and integrated core components, such as CPUs, GPUs and APs, of increasingly more functional and integrated mobile devices, tablet PCs and the like.SOLUTION: The printed circuit board includes a circuit board 100 having a cavity, and a connection board 10A including metal patterns 15a, 15b, 25a, 25b, the connection board being received in the cavity with the metal patterns disposed vertically in the circuit board.SELECTED DRAWING: Figure 1
申请公布号 JP2016208000(A) 申请公布日期 2016.12.08
申请号 JP20150193797 申请日期 2015.09.30
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 LEE JEONG-HO;KWEON YOUNG-DO;KIM HYOUNG-JOON;HARR KYOUNG-MOO;OH KYUNG-SEOB
分类号 H05K3/46;H01L23/12;H01L25/065;H01L25/07;H01L25/18 主分类号 H05K3/46
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