发明名称 |
Semiconductor device and method of manufacturing the same |
摘要 |
The present invention relates to a semiconductor device employed for high power use and a method of manufacturing the same. According to the present invention, a temperature detecting device is formed on the same substrate with a power device. Thus, there is no need to add an external temperature sensor, whereby the device can be reduced in size. Further, an abnormal temperature of the power device is accurately detected by the temperature detecting device, whereby thermal breakdown of the power device is reliably prevented.
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申请公布号 |
US4971921(A) |
申请公布日期 |
1990.11.20 |
申请号 |
US19890440213 |
申请日期 |
1989.11.22 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
FUKUNAGA, MASANORI;MAJUMDAR, GOURAB |
分类号 |
H01L27/02;H01L27/04;H01L29/08;H01L29/10;H01L29/78;H02H5/04;H03K17/14 |
主分类号 |
H01L27/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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