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发明名称
RESIN-SEALING METHOD FOR SEMICONDUCTOR DEVICE
摘要
申请公布号
JPH02295140(A)
申请公布日期
1990.12.06
申请号
JP19890116313
申请日期
1989.05.09
申请人
NEC CORP
发明人
OBA YOSHIHARU
分类号
H01L21/56
主分类号
H01L21/56
代理机构
代理人
主权项
地址
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