POLISHING APPARATUS

摘要

A polishing apparatus for polishing an object to be polished at a high flatness. This apparatus comprises at least one plate adaptable to have at least one object to be polished secured at an underside thereof, a head section surrounding the plate with a predetermined gap therebetween, pressure applying means for applying a pressing force to the upside of the plate, and holding means for holding the plate in a direction of a plane of polishing movement of the object to be polished. The pressure applying means and the holding means are both disposed in an inner space of the head section, the latter means being movable in the direction perpendicular to the plane of polishing movement. The attaching position of the holding means on the outer surface of the plate is set substantially at the same height as or at a position lower than the attaching position of the holding means on the inner surface of the head section. The intersecting point of the imaginary lines through the fixing positions of the holding means on the head section and those corresponding to them on the plate substantially lies on or at a position lower than the polishing surface of the object to be polished.