Mounting block and a mounting assembly that incorporates the mounting block

摘要

A mounting block is provided that has a multi-level upper surface that is used to mount one or more IC chips and the printed circuit board (PCB) thereon at heights that allow the lengths of the bond wires interconnecting the chips with the PCB and/or with the other IC chips to be reduced. The distances between the levels of the multi-level surface are preselected based at least in part on the known height of the PCB and the known height of at least one of the IC chips such that when the chip and the PCB are mounted on the mounting block, the distance between the contact pads of the PCB and the contact pads of the IC chip is very small, thereby allowing the lengths of the bond wires to be kept very short.

主权项

1. A mounting assembly for mounting a circuit board and one or more integrated circuit (IC) chips thereon, the mounting assembly comprising:
a mounting block comprising a bottom surface and a multi-level mounting surface, the multi-level upper surface comprising N mounting surfaces, where N is a positive integer that is greater than or equal to 2, said N mounting surfaces including at least a first-level mounting surface and a second-level mounting surface, the bottom surface being connected to the first-level mounting surface by first side walls of the mounting block, the first-level mounting surface being connected to the second-level mounting surface by second side walls of the mounting block, the first-level mounting surface being a first distance, d1, from the bottom surface in a direction generally normal to the first-level mounting surface and to the bottom surface, the second-level mounting surface being a second distance, d2, from the first-level mounting surface in a direction generally normal to the first-level mounting surface and to the second-level mounting surface; at least a first electrical component mounted on the second-level mounting surface; and a circuit board mounted on the first-level mounting surface, and wherein the first and second distances d1 and d2, respectively, are preselected such that a top surface of the first IC chip is a first preselected distance from a top surface of the circuit board in a direction generally normal to the top surfaces, wherein a bottom surface of the circuit board is in contact with the first-level mounting surface, and wherein the bottom surface of the circuit board is connected to a top surface of the circuit board by side walls of the circuit board, and wherein a cutaway portion of the circuit board forms an opening in the circuit board that is definable by the inside walls of the circuit board, and wherein the inside walls of the circuit board surround the second side walls that connect the first-level mountain surface to the second-level mounting surface, and wherein electrical contact pads of the circuit board are disposed on the top surface of the circuit board adjacent the inside walls of the circuit board, and wherein the electrical contact pads of the first IC chip are disposed on the top surface of the first IC chip about a peripheral portion of the first IC chip that is adjacent the opening formed in the circuit board.