RESIN SEAL DIE FOR SEMICONDUCTOR DEVICE,申请号JP19890179250-传众专利搜索

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发明名称	RESIN SEAL DIE FOR SEMICONDUCTOR DEVICE
摘要
申请公布号	JPH0344042(A)	申请公布日期	1991.02.25
申请号	JP19890179250	申请日期	1989.07.11
申请人	NEC CORP	发明人	MATSUBARA YUJI
分类号	H01L21/56;B29C45/17	主分类号	H01L21/56
代理机构		代理人
主权项
地址

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