摘要 |
An electronic module having a high density of silicon IC chips is provided by mounting the chips in tapered through-holes in a silicon substrate, filling the edge gaps between the chips and the substrate with a glass so that the chips, the filler glass, and the substrate have a smooth upper surface adapted to receive monolithic interconnections formed by planar metallization methods. The resulting assembly is enclosed in a housing also formed substantially from silicon, which contains electrically isolated pins for contacting the input-output electrodes of the assembly. Preferential etching is used to form the through-holes in the substrate as well as various alignment means on the substrate and other parts of the housing so that they are self-aligning during assembly. Improved performance, reliability, and low cost is obtained. |
申请人 |
MOTOROLA, INC., SCHAUMBURG, ILL., US |
发明人 |
DRYE, E., JAMES, MESA, AZ 85203, US;SCHROEDER, A., JACK, AUSTIN, TX 78758, US;WINCHELL, H., II, VERN, SCOTTSDALE, AZ 85254, US |