发明名称 Pressure molding means for powder
摘要 A pressure molding device having a powder supporting flat face formed by the end face of a pressure ram or a pressure-submissive block and a reciprocating vertical sleeve. The layer of powder formed on the flat face and having a uniform density is cut with the vertical sleeve's end for molding. A molded body has a uniform density in all portions and deformation does not occur in the course of sintering for producing semiconducting or insulating base boards.
申请公布号 US5037287(A) 申请公布日期 1991.08.06
申请号 US19900537208 申请日期 1990.06.07
申请人 HIRAI, AKIRA 发明人 HIRAI, AKIRA
分类号 B30B11/00;B28B3/02;B28B3/08;B28B13/02;B30B11/02;B30B11/04;B30B15/30 主分类号 B30B11/00
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