发明名称 METHOD FOR PROCESSING PHOTORESITS
摘要 <p>The side wall profile improvement of photoresist is obtained by controlling the encroaching rate with baking tem,perature. The baking temperature of photoresist (2) deposited on silicon wafer (1) changes with the temperature gradient of T1<T2<T3 from the upper layer to lower layer. The thermal plate is used in baking process.</p>
申请公布号 KR910006041(B1) 申请公布日期 1991.08.12
申请号 KR19890007679 申请日期 1989.06.03
申请人 SAM SUNG ELECTRONICS CO.,LTD. 发明人 KANG HO-YONG
分类号 G03F7/20;G03F7/26;(IPC1-7):G03F7/26 主分类号 G03F7/20
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