Method for Producing a Circuit Carrier Arrangement Having a Carrier which has a Surface Formed by an Aluminum/Silicon Carbide Metal Matrix Composite Material

摘要

According to a method for producing a circuit carrier arrangement, a carrier which has a surface section formed by an aluminum/silicon carbide metal matrix composite material is provided. A circuit carrier, which has an insulation carrier with a lower side onto which a lower metallization layer is applied, is also provided. A bonding layer, which contains a glass, is generated on the surface section. A material-fit connection between the bonding layer and the circuit carrier is produced by means of a connecting layer.

主权项

1. A method for producing a circuit carrier arrangement, which comprises:
provision of a carrier which has a surface section formed by an aluminum/silicon carbide metal matrix composite material; provision of a circuit carrier which has an insulation carrier with a lower side onto which a lower metallization layer is applied; generation of a bonding layer, which contains a glass, on the surface section; production of a material-fit connection between the bonding layer and the circuit carrier by means of a connecting layer.