SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of making electronic devices, and electronic devices manufactured thereby, that comprise utilizing a compressed interconnection structure (e.g., a compressed solder ball, etc.) in an encapsulating process to form an aperture in an encapsulant. The compressed interconnection structure may then be reformed in the aperture.

主权项

1. An electronic device comprising:
an electronic component comprising a conductive pad; an encapsulating material on the electronic component; an aperture through the encapsulating material that exposes the conductive pad, the aperture defined by an inner surface of the encapsulating material and shaped like a portion of an oblate ellipsoid; and a conductive interconnection structure that extends through the aperture and protrudes from the encapsulating material, is electrically connected to the conductive pad, and is separated from at least a portion of the inner surface of the encapsulating material.